Professor of Mechanical Engineering
Author/co-authored of 400 peer-reviewed journal articles and 3 books
Editorial member of Mechanics of Advanced Materials and Structures,
International Journal of Mechanical Sciences, Journal of Thermal Stresses, Composite Structures …
Dr. Weiqiu Chen is a Professor of the Department of Engineering Mechanics, Zhejiang University. His research interests include mechanics of smart materials/structures, mechanics of soft materials and structures, and vibration/waves in structures for nearly thirty years. He has co-authored over 400 peer-reviewed journal articles and three English books on elasticity of transversely isotropic materials, piezoelectricity, and Green’s functions, respectively. He now serves as the editorial member (or associate editor or associate editor-in-chief) of more than a dozen of academic journals including Mechanics of Advanced Materials and Structures, Journal of Zhejiang University – SCIENCE A, International Journal of Mechanical Sciences, Journal of Thermal Stresses, Composite Structures, Acta Mechanica Solida Sinica, and Applied Mathematics and Mechanics (English Edition).
In this work, three-dimensional exact solutions of adhesive contact between a pre-deformed compressible soft electroactive half-space and an axisymmetric rigid indenter are first presented. The change of surface adhesion energy during the contact is examined by using the modified JKR model, which accounts for the real contact area instead of the projected area. With the help of new results in the potential theory method, all physical (field) variables are derived in terms of elementary functions for three common types of axisymmetric indenters (flat-ended, conical, and spherical). The analytical contact relations for different indenter geometries and material properties are provided, which can serve a solid base for revealing the underlying electromechanical mechanism of soft electroactive materials. For numerical illustration, neo-Hookean isotropic electroactive material is considered. The simulation results clearly demonstrate that both the mechanical and electric biasing fields significantly affect the indentation measurement of the electroactive material. Moreover, at either micro- or nanoscale, adhesion is found to play a prominent role in the indentation responses.